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S3 dual-core processor and W2 Apple wireless chip
225 DMIPS/1
Ford Module Engine Fuel - 1
Seagate Expansion STEA500400
1100 RDNT 13 LITEON 4
Micron Technology DRAM SDRAM-DDR4, Part #: MTA72ASS16G72LZ-3G2B3 | Dynamic random access memory | DEX Chip S3 dual-core processor and W2Micron Technology DRAM , Part #: MTA72ASS16G72LZ 3G2B3 features: 288 pin, command address control registered, data buffered, load reduced dual in line memory module (LRDIMM) Fast data transfer rates: PC4 3200, PC4 2933 128GB (16 Gig x 72) Quad rank, using 32Gb TwinDie DDR4 Each die with 16 internal banks; 4 groups of 4 banks each MIL: MTA72ASS16G72LZ 3G2B3 MTA72ASS16G72LZ 3G2B3
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